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    Active Frequency Multipliers

            18 to 26.5 GHz  26.5 to 40 GHz  33 to 50 GHz  40 to 60 GHz  50 to 75 GHz  75 to 110 GHz

Configuration and Assembly

Electrical Testing and Verification

Information

                                                                        

Configuration and Assembly

The multipliers are built using high precision thin film alumina micro circuitry with PHEMT GaAs MESFET MMIC and individual devices as the active components.  Assembly uses both high temperature die attach and epoxy mount. Interconnection of the components is completed with either gold wire or ribbon bonding.  Sample destruct testing is performed on both attachment and bonding to insure compliance to the manufacturing process.  Final assembly is within an epoxy sealed machined package (or hermetically laser sealed depending on the customer needs).

 

       

 Electrical Testing and Verification

Each individual unit is tested to insure compliance to the electrical specifications over the required environmental conditions.  A test sheet for each individual unit is completed verifying testing and the associated results. A burn in of each unit is completed to prior to final testing and shipping to further insure product integrity.

Process evaluation and verification of any new design implementation is performed using a detailed environmental test matrix that stresses the new design to insure integrity. Implementation of new active or control devices requires a minimum 1000 hours operating burn in at the maximum operating temperature of those devices.

  

 

Information

To submit your specific specification for quote, use the following link which can be mailed to our applications group for quotation.

Multiplier Specification Form

For additional questions and clarification contact sales@nordengroup.com

 
Send mail to Sales@NordenGroup.Com with questions or comments about this web site.
Copyright © 2005 Norden Millimeter
Last modified: 08/02/07
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