Norden VCO and DRO assemblies are built using high precision thin film alumina micro circuitry with PHEMT GaAs MESFET MMIC and individual silicon devices as the active components.  Assemblies use both high temperature die attach and epoxy mount.  Interconnection of the components is completed with either gold wire or ribbon bonding.  Sample destruct testing is performed on both attachment and bonding to insure compliance to the manufacturing process.  Final assembly is within an epoxy sealed machined package (or hermetically laser sealed depending on the customer needs).

Electrical Testing and Verification

Each individual unit is tested to insure compliance to the electrical specifications over the required environmental conditions.  A burn in of the unit is completed prior to final testing and shipping to insure product integrity. A test sheet for the unit is completed verifying testing and the associated results.

Process evaluation and verification of any new design implementation is performed using a detailed environmental test matrix that stresses the new design to insure integrity.  Implementation of new active or control devices requires a minimum 1000 hours operating burn in at the maximum operating temperature of those devices.

Information

For additional questions and clarification contact sales@nordengroup.com