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The amplifiers are built using high precision thin film alumina
micro circuitry with PHEMT GaAs MESFET MMIC and individual
devices as the active components. Assembly uses both high
temperature die attach and epoxy mount. Interconnection of the
components is completed with either gold wire or ribbon
bonding. Sample destruct testing is performed on both attachment
and bonding to insure compliance to the manufacturing process.
Final assembly is within a laser sealed hermetic machined
package (or epoxy sealed depending on the customer needs).
Each individual unit is tested to insure compliance to the
electrical specifications over the required environmental
conditions. A burn in of the unit is completed prior to final
testing and shipping to insure product integrity. A test sheet
for the unit is completed verifying testing and the associated
results.
Process evaluation and verification of any new design
implementation is performed using a detailed environmental test
matrix that stresses the new design to insure integrity.
Implementation of new active or control devices requires a
minimum 1000 hours operating burn in at the maximum operating
temperature of those devices.
Amplifier Specification Form
For additional questions and clarification contact
sales@nordengroup.com |
