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Active Frequency Multipliers
Configuration and Assembly
Electrical Testing and Verification
Information
 
The
multipliers are built using high precision thin film alumina micro circuitry
with PHEMT GaAs MESFET MMIC and individual devices as the active components.
Assembly uses both high temperatures die attach and epoxy mount. Interconnection
of the components is completed with either gold wire or ribbon bonding. Sample
destruct testing is performed on both attachment and bonding to insure
compliance to the manufacturing process. Final assembly is within a laser sealed
hermetic machined package (or epoxy sealed depending on the customer needs).
Electrical Testing and Verification
Each
individual unit is tested
to insure compliance to the electrical specifications over the required
environmental conditions. A test sheet for each individual unit is completed
verifying testing and the associated results. A burn in of each unit is
completed to prior to final testing and shipping to further insure product
integrity.
Process
evaluation and verification of any new design implementation is performed using
a detailed environmental test matrix that stresses the new design to insure
integrity. Implementation of new active or control devices requires a minimum
1000 hours operating burn in at the maximum operating temperature of those
devices.
To submit
your specific specification for quote, use the following link which can be
mailed to our applications group for quotation.
Multiplier Specification Form
For
additional questions and clarification contact
sales@nordengroup.com
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